The manufacturing of THR compatible connector products requires to pay attention to material and design changes directed towards the optimization of the components solderability with respect to typical SMT soldering processes.
Housing considerations include the selection of a polymer having appropriate temperature capability and the redesign of the housing to provide stand-off and air flow capacity. The contact pin length and platings must be optimized to ensure solderability and pin geometry must be considered in solder volume calculations. The process plays an important role in this technology: therefore, it has to be carefully set and adapted to the components intended to be mounted. As for SMT components, the reflow profile must be calculated considering several parameters that are specific to each different board and to the reflow technology being used.