Panasonic Industry Develops High-Thermal Conductive Film for Multilayer Circuit Boards

Panasonic Industry Co., Ltd. announced that it has developed the high-thermal conductive film R-2400 for multilayer circuit boards.

In recent years, electric vehicles (xEVs) have become increasingly popular due to growing interest in environmental issues. To improve the energy efficiency of electric vehicles, batteries, power supply modules, and drive units have become even more powerful.

This increases the need for power semiconductors such as SiC and GaN, posing significant challenges for the thermal management of equipment. In addition, weight reduction and the miniaturization of power supply modules and drives are required to increase the cruising range of electric vehicles as well as improve passenger comfort by expanding vehicle interior space.

Accordingly, Panasonic Industry has developed the high-thermal conductive film R-2400 for multilayer circuit boards. The film has achieved industry firsts in both high-thermal conductivity of 2.7 W/m・K and excellent resin flowability that enables the multilayering of circuit boards.

The new product mitigates the effects of heat generated by power semiconductors and can be used in multilayer circuit boards?something difficult to achieve with conventional high-thermal conductive materials. It will also be appropriate for use in component-embedded circuit boards and those with thick copper foil. These features contribute to the reduction of power consumption (electricity costs) of electric vehicles and the reduction of CO2 emissions because of their effect on weight reduction and the miniaturization of power supply modules and drives.

Key Features

Applications

Multilayer circuit boards and component-embedded circuit boards used for core power supply components that require heat management measures (vehicle chargers, power supplies for railroads, power conditioners for photovoltaic power generation, inverters, step-up converters, and more)

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