Molex Acquires Smiths Interconnect
Molex announces agreement to acquire Smiths Interconnect, enhancing its position in aerospace and Defense. Molex, a leading global electronics connectivity...
Molex announces agreement to acquire Smiths Interconnect, enhancing its position in aerospace and Defense. Molex, a leading global electronics connectivity...
Kyocera Launches 5908 Series: Fully Shielded Board-to-Board Connectors for High-Speed, EMI-Resilient Applications. Kyocera Corporation has introduced the 5908 Series, a...
Samtec, Inc., announces the addition of two connector product lines that meet or exceed Severe Environment Testing qualification standards. Samtec, Inc.,...
This presentation by René Linde, Field Application Engineer at Würth Elektronik published by All About Circuits discusses PCB design challenges...
Samtec, Inc., the service leader in the connector industry and a premier provider of high-speed connectivity solutions, and Molex, a global...
Panasonic Industry will double the production capacity of MEGTRON multi-layer circuit board materials over the next five years. To meet...
This paper based on post Samtec’s Cable Management in High‑Data‑Rate Applications offering a cbrief framework for engineers, technicians, and system integrators...
Samtec is excited to introduce the newest members of its AcceleRate HP® high-performance array family: 800-position APM6, APF6 at a 5 mm stack height. The...
Connector industry achieves double-digit growth according to the recent article by Ron Bishop, Bishop & Associates Inc., published by TTI Market...
KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...
© 2023 EPCI - Premium Passive Components & Inter-Connect News
© 2023 EPCI - Premium Passive Components & Inter-Connect News