• Latest
  • Trending

THR (Through Hole Reflow) Technology: Introduction & History:

September 12, 2022

Microwave Multi Line Connectors Mounting and Handling Precautions

March 27, 2023

Samtec New Interconnects Enhances Power and Signal Integrity

March 21, 2023
PCNS Passive Components Symposium 11-14th September 2023

PCB Via Design Selection; Plugging-Filling-Tenting

March 20, 2023

Lemo Releases New Multi Coaxial High Frequency Connector

March 2, 2023

Würth Elektronik Introduces Crimp SKEDD Connectors

March 1, 2023

binder Offers Sensor Connectors in Stainless-Steel to Protect Against Corrosion

March 1, 2023

Board-to-Board Connection & Antennas HF Connection

February 20, 2023

How to Ensure Board-to-Board Connectors Meet High-Speed Automotive Assembly and Use Requirements

February 16, 2023

Amphenol Enhanced its ePower-Lite EV Line to Include 3-Pole Connector

February 15, 2023

BASIC PCB Design Rules – Layout

February 15, 2023

Connector Inrush Current Explained

February 3, 2023

M8 Connectors for Smart Farming Applications

January 31, 2023
  • Privacy Policy
inter-connection blog
  • NEWS
  • Knowledge base
  • Sister Sites
    • Passive Components Blog
    • PCNS Symposium
    • The Passives Times
    • EPCI Home
  • About
No Result
View All Result
  • NEWS
  • Knowledge base
  • Sister Sites
    • Passive Components Blog
    • PCNS Symposium
    • The Passives Times
    • EPCI Home
  • About
No Result
View All Result
inter-connection blog
No Result
View All Result

THR (Through Hole Reflow) Technology: Introduction & History:

September 12, 2022
A A

The through-hole technology dates back to the 50’s and was primarily accomplished through wave soldering processes. Components, including connectors, were press-fit into Plated Through Holes (PTH) in a Printed Circuit Board (PCB) and then soldered, generally by wave soldering.

The pioneer work in SMT started in the 60s and had its breakthrough in the 80s. This technology consists in soldering components to lands on the surface of a PCB using a number of different soldering processes. Typically, a solder paste was screened onto the lands on the PCB and the solder paste was subsequently reflowed by a variety of heating processes. SMT capability was originally limited to smaller components and devices, but expanded to include larger components over time. SMT capability brought significant reductions in the PCB size due to reductions in the component size and in the board area required for routing signals. Figure 2.77 illustrates some stages of this evolution.

Fig. 2.77: PCB evolution

Initially, connectors were conspicuous by their absence from SMT processing. There were two major reasons for this absence: first, the size of connectors was large compared to that of other SMT components, and second, connectors are subject to mating and unmating forces that exceed the strength capability of the surface solder joints of SMT. This meant that connectors had to be added to a PCB using Through Hole Technology (THT) through compliant pin press-in technologies or through a secondary soldering process e.g. manual or wave soldering.

Eventually SMT versions of smaller connectors were developed. In recent years, however, Through Hole Reflow (THR) or Pin In Paste (PIP) processes have been developed that allow connectors to be reflow soldered in the same soldering process as the SMT components on the board. THR processing results in significant reductions in manufacturing costs as well as in additional savings in PCB board area.

Related

Source: Wurth elektronik
Next Post

Housing Considerations

Contact Considerations

Component Lead Terminations

Popular Posts

  • Crimped Connections

    0 shares
    Share 0 Tweet 0
  • Basic Principles of Connectors

    0 shares
    Share 0 Tweet 0
  • Space Saving Molex Connector in AR/VR System designs

    0 shares
    Share 0 Tweet 0
  • THR (Through Hole Reflow) Technology: Introduction & History:

    0 shares
    Share 0 Tweet 0
  • The Electrical Interface: Contact Resistance

    0 shares
    Share 0 Tweet 0

Archive

2023
2022

  • About
  • Inter-Connection News
  • Knowledge base
  • NEWS
  • Privacy Policy
  • Sister Sites

© 2023 EPCI - Premium Passive Components & Inter-Connect News

No Result
View All Result
  • About
  • Inter-Connection News
  • Knowledge base
    • Applications
    • Basic Principles of Connectors
    • Design Selection Assembly
  • NEWS
  • Privacy Policy
  • Sister Sites

© 2023 EPCI - Premium Passive Components & Inter-Connect News

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.