THR (Through Hole Reflow) Technology: Introduction & History:
The through-hole technology dates back to the 50’s and was primarily accomplished through wave soldering processes. Components, including connectors, were...
The through-hole technology dates back to the 50’s and was primarily accomplished through wave soldering processes. Components, including connectors, were...
As with PCB technology, the literature on solder and soldering technologies is extensive and beyond the scope of this volume....
Compliant press-in technology was developed primarily by, and for, the telecommunications industry in the ’70s to replace soldered press-in pins....
Figure 2.64 schematically illustrates the components of a multilayer PCB prior to laminating. This PCB will have six layers. Fig....
The literature on Printed Circuit Boards (PCB) is extensive and details on the design and manufacture of PCBs are outside...
Insulation Displacement Connectors (IDC) are used primarily on cables, in particular ribbon cables, in cable-to-cable or cable-to-board applications. Prior to...
From its beginnings in the 1940s, crimped connections have been the dominant permanent connection technology for the white goods and...
As noted, there are two mechanical permanent connection technologies for wire and cable, crimped and insulation displacement connections. Crimped connections...
In general permanent connections are intended to be exactly that, permanent connections, once and done. Therefore they are not limited...
After this discussion about the effects of contact normal force, attention now turns to the design and material parameters that...
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© 2023 EPCI - Premium Passive Components & Inter-Connect News