Harwin Releases New Generation of Floating Board-to-Board Connectors
Harwin releases Flecto, the new generataion of floating board to board connectors to support high-speed automated manufacture and long-term operational...
Read moreDetailsHarwin releases Flecto, the new generataion of floating board to board connectors to support high-speed automated manufacture and long-term operational...
Read moreDetailsThis technical blog article written by Raul Saucedo, KYOCERA-AVX Components Corporation, explains benefits and use of card edge board to board connectors...
Read moreDetailsKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...
Read moreDetailsSamtec offers the largest variety of high-speed connector board-to-board and backplane interconnects in the industry. With so many options, unfortunately,...
Read moreDetailsSamtec has expanded its successful line of Edge Rate® board-to-board connectors to include a higher density mated set that is...
Read moreDetailsIn this Würth Elektronik webinar you will learn more about PCB based power distribution units and the power connection possibilities....
Read moreDetailsThis post if based on Samtec blog article that digest needs for interconnection for AI Artificial Intelligent systems. Every element...
Read moreDetailsHIROSE ELECTRIC has released the BK35 series of RF-compatible substrate-to-FPC connectors with a full shield structure and combined power and...
Read moreDetailsSamtec, Inc.’s Generate™ high-speed edge card sockets (HSEC6-DV Series) support 64 Gbps PAM4 (32 Gbps NRZ) applications and are PCIe® 6.0 capable....
Read moreDetailsKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future,...
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© 2023 EPCI - Premium Passive Components & Inter-Connect News