Low Profile Solderless Flat Interconnect for Space Applications
This article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
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News
binder Offers M16 Circular Connectors for Efficient Crimp Termination Mount
Crimp variants of the M16 product series from binder simplify wiring – in small quantities on site, but also automated...
Read moreDetailsThermal Management of High Performance PCB System
This Würth Elektronik video tutorial focuses on the possibilities of intelligent PCB-based thermal management and which PCB design goals can...
Read moreDetailsHigh Density Interconnect PCBs
This webinar from Würth Elektronik continue series "PCB Production" with High Density Interconnect (HDI) PCBs. In this video you will...
Read moreDetailsPasternack’s New Line of Interconnects Enables High-Resolution Video Transmission
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has broadened its line of...
Read moreDetailsRF Interconnect for Autonomous Technology
In this video Dale Wilson, All About Circuits chats with Ron Orban of Amphenol RF about their Interconnect for Autonomous...
Read moreDetailsWürth Elektronik Presents Reference Design for its Gigabit Ethernet Interfaces
Würth Elektronik has published its RD016 reference design (https://www.we-online.com/RD016) and the corresponding application note ANP116 (https://www.we-online.com/ANP116) for its Gigabit Ethernet...
Read moreDetailsSerial Interfaces Explained; WE Video
A short video describing the different serial interfaces methods for radio modules and sensors. Würth Elektronik describes and show how...
Read moreDetailsSamtec Released Ganged SMPM RF Connector: New High Density, Push-On RF Solutions
Samtec released Magnum RF™, which are ganged, multi-position SMPM RF Connector blocks and cable assemblies for millimeter-wave applications. Magnum RF...
Read moreDetailsHarting Offers 3D-Circuit Tracks Mould Prints
Harting is offering 3D-circuit tracks prints on injection-moulded thermoplastic 3d objects, calling the process ‘3D-Mid’. The most remarkable aspect of...
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