Low Profile Solderless Flat Interconnect for Space Applications
This article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
Read moreThis article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
Read moreThis Würth Elektronik video tutorial focuses on the possibilities of intelligent PCB-based thermal management and which PCB design goals can...
Read moreThis webinar from Würth Elektronik continue series "PCB Production" with High Density Interconnect (HDI) PCBs. In this video you will...
Read moreHarting is offering 3D-circuit tracks prints on injection-moulded thermoplastic 3d objects, calling the process ‘3D-Mid’. The most remarkable aspect of...
Read moreThis second part of Würth Elektronik PCB webinar on RIGID.flex technology is intended as an introduction to the production of...
Read moreIn this video Würth Elektronik covers how shielding efficiency is calculated, coupling effects, how to prevent them, and the role...
Read moreThis first part of Würth Elektronik PCB webinar on RIGID.flex technology is intended as an introduction to the production of...
Read moreThis Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect...
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© 2023 EPCI - Premium Passive Components & Inter-Connect News