This Würth Elektronik webinar discusses PCB rigid-flex soldermask or coverlay options, compare its benefits and limitations. Rigid-flex printed circuit boards...
Read more
In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and...
Read more
Knowles Precision Devices blog article describes use of thin film technology on ceramic substratesfor interconnects and interposers. Innovation in advanced...
Read more
Panasonic Industry Co., Ltd. announced that it has developed the high-thermal conductive film R-2400 for multilayer circuit boards. In recent...
Read more
This video from Murata covers handling precautions to ensure that microwave multi line connectors are used properly. Refer to this...
Read more
In this Würth Elektronik webinar you will learn more about PCB design rules and layout. Würth Elektronik BASIC Design Rules...
Read more
This article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
Read more
This Würth Elektronik video tutorial focuses on the possibilities of intelligent PCB-based thermal management and which PCB design goals can...
Read more
This webinar from Würth Elektronik continue series "PCB Production" with High Density Interconnect (HDI) PCBs. In this video you will...
Read more
Harting is offering 3D-circuit tracks prints on injection-moulded thermoplastic 3d objects, calling the process ‘3D-Mid’. The most remarkable aspect of...
Read more
