Knowles Precision Devices blog article describes use of thin film technology on ceramic substratesfor interconnects and interposers. Innovation in advanced ...
Smiths Interconnect announced the release of its highly anticipated Space Qualified version of the KVPX connector series. This significant advancement ...
Embedded computing engineers love the versatility, flexibility and scalability that SoMs offer in system architecture design. Samtec blog describes how high-speed ...
Molex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, ...