Evaluating the Reliability of Miniature Array Connectors
In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and ...
In a new white paper from Samtec, “Improved Solder Joint Integrity for High-Density Interconnect Applications,” the authors, Robbie Huffman and ...
Current Carrying Capacity or Current Carrying Capability (CCC) is a common specification for connector families of all shapes and sizes. As ...
Embedded computing engineers love the versatility, flexibility and scalability that SoMs offer in system architecture design. Samtec blog describes how high-speed ...
Samtec blog published interview with Ron Bishop – President of Bishop and Associates, connector industry expert, and friend of Samtec – ...
Magnets and magnetic fields can cause big problems in medical, scientific, industrial, space, and quantum computing applications but using non-magnetic ...
Connector Geek David Pike speaks with Samtec’s Keith Guetig and Andy Shrout about high-speed data cables. The need for reliable, ...
Samtec new connector system improves signal integrity by improving power integrity. Optimizing power integrity provides greater signal integrity margin and ...
Samtec published a post on 2023 connector industry forecast based on questions to Mr. Ron Bishop, President of Bishop and Associates. ...
Thermal management and temperature derating have always been something that designers have had to plan for to keep their products ...
Samtec released Magnum RF™, which are ganged, multi-position SMPM RF Connector blocks and cable assemblies for millimeter-wave applications. Magnum RF ...
© 2023 EPCI - Premium Passive Components & Inter-Connect News
© 2023 EPCI - Premium Passive Components & Inter-Connect News