Low Profile Solderless Flat Interconnect for Space Applications
This article is based on ESA SPCD 2022 paper entitled “Low profile and solderless solutions for flat space interconnect” written...
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PCB interconnect news
Thermal Management of High Performance PCB System
This Würth Elektronik video tutorial focuses on the possibilities of intelligent PCB-based thermal management and which PCB design goals can...
Read moreDetailsHigh Density Interconnect PCBs
This webinar from Würth Elektronik continue series "PCB Production" with High Density Interconnect (HDI) PCBs. In this video you will...
Read moreDetailsHarting Offers 3D-Circuit Tracks Mould Prints
Harting is offering 3D-circuit tracks prints on injection-moulded thermoplastic 3d objects, calling the process ‘3D-Mid’. The most remarkable aspect of...
Read moreDetailsRigid Flexible PCB Production Internal Flex Layers
This second part of Würth Elektronik PCB webinar on RIGID.flex technology is intended as an introduction to the production of...
Read moreDetailsShielding, A Practical Approach
In this video Würth Elektronik covers how shielding efficiency is calculated, coupling effects, how to prevent them, and the role...
Read moreDetailsRigid Flexible PCBs Construction
This first part of Würth Elektronik PCB webinar on RIGID.flex technology is intended as an introduction to the production of...
Read moreDetailsHigh Density Interconnect Support PCB Miniaturization
This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect...
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