• Latest
  • Trending

Murata Announced Completion of New Plating Research Building in Japan

September 19, 2023

binder Unveils Quick Lock Ruggedized Power Bayonet

October 3, 2023

Connector Temperature Rise and Derating

September 29, 2023

Connector Raw Material Costs Decreased 6.9 Percent in Q2 2023

September 27, 2023

Webinar PCBs: RIGID.flex with Flexible Soldermask or Coverlay?

September 20, 2023

Samtec Expands with a New Cable and RF Connector Manufacturing Facility in Pennsylvania

September 20, 2023

KYOCERA AVX Unveils New Series Poke-Home Single Contacts

September 20, 2023

RF Compression-Mount Connectors Enhance Millimeter Wave Designs

September 1, 2023

Würth Elektronik Introduces micro SIM Card Interface with Card Detection

August 31, 2023

Yamaichi Extended Board-to-Cable Connectors for Battery Management

August 15, 2023

How the Connector Blade Assignments Impact Power Integrity 

August 15, 2023

How to Maintain 50 Ohms RF Transmission Path

August 15, 2023

Understanding the Benefits of a Flyover Cable System

July 28, 2023
  • Privacy Policy
inter-connection blog
  • Home
  • Knowledge base
  • Sister Sites
    • Passive Components Blog
    • PCNS Symposium
    • The Passives Times
    • EPCI Home
  • About
No Result
View All Result
  • Home
  • Knowledge base
  • Sister Sites
    • Passive Components Blog
    • PCNS Symposium
    • The Passives Times
    • EPCI Home
  • About
No Result
View All Result
inter-connection blog
No Result
View All Result

Murata Announced Completion of New Plating Research Building in Japan

September 19, 2023
A A

Sabae Murata Manufacturing Co., Ltd. (in Sabae, Fukui Prefecture,Japan), a manufacturing subsidiary of Murata Manufacturing Co., Ltd., has completed a new research and development building that had been under construction on its premises since February 2022.

The new research and development building will be used for developing plating technology suitable for making electronic components smaller, thinner, and lighter, as well as the necessary technology to bring it to mass production. 

RelatedPosts

Microwave Multi Line Connectors Mounting and Handling Precautions

Overview of the new R&D building

Structure and scale:  Steel-frame construction, 6 stories above ground, 1 below
Total floor area:11,322㎡
Building area:1,797㎡
Total investment: 6.6 billion yen (building only) 
Purpose: Development and launch of plating technology
Location: Sabae Murata Manufacturing Co., Ltd. (2-82, 1-chome, Miyukicho, Sabae-shi, Fukui Prefecture, Japan) 

Related

Source: Murata
Next Post

KYOCERA AVX Unveils New Series Poke-Home Single Contacts

Samtec Expands with a New Cable and RF Connector Manufacturing Facility in Pennsylvania

Webinar PCBs: RIGID.flex with Flexible Soldermask or Coverlay?

Popular Posts

  • Crimped Connections

    0 shares
    Share 0 Tweet 0
  • THR (Through Hole Reflow) Technology: Introduction & History:

    0 shares
    Share 0 Tweet 0
  • Basic Principles of Connectors

    0 shares
    Share 0 Tweet 0
  • The Electrical Interface: Contact Resistance

    0 shares
    Share 0 Tweet 0
  • Space Saving Molex Connector in AR/VR System designs

    0 shares
    Share 0 Tweet 0

Subscribe to Blog via Email

Enter your email address to subscribe to this blog and receive notifications of new posts by email.

Archive

2023
2022

Newsletter Subscribe

  • About
  • Inter-Connection Blog
  • Inter-Connection News
  • Knowledge base
  • NEWS
  • Privacy Policy
  • Sister Sites
  • Subscribe

© 2023 EPCI - Premium Passive Components & Inter-Connect News

No Result
View All Result
  • About
  • Inter-Connection Blog
  • Inter-Connection News
  • Knowledge base
    • Applications
    • Basic Principles of Connectors
    • Design Selection Assembly
  • NEWS
  • Privacy Policy
  • Sister Sites
  • Subscribe

© 2023 EPCI - Premium Passive Components & Inter-Connect News

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.